LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.
|Published (Last):||1 February 2006|
|PDF File Size:||13.74 Mb|
|ePub File Size:||10.18 Mb|
|Price:||Free* [*Free Regsitration Required]|
The LM is a stereo audio amplifier capable of delivering.
SPiKe Protection dayasheet that these. Each amplifier within the LM has an independent. Typical Audio Amplifier Application Circuit. Numbers in parentheses represent pinout for amplifier B.
Single Supply Application Circuit.
Overture Audio Power Amplifier Series Dual 40-Watt Audio Power Amplifier With Mute
Single Supply Amplifier Application Circuit. Auxiliary Amplifier Application Circuit. Special Audio Amplifier Application Circuit. Taking into account supply line fluc. Upon system power-up, the under-voltage protection cir. The LM contains over-voltage protection circuitry that. The clamping effect is quite the same.
The LM is protected from instantaneous peak. Operating graph in the Typical Performance Characteris. SPiKe Protection Circuitry is not enabled.
Thus by knowing the total supply voltage and rated output. The package dissipation is twice the number which datqsheet. Refer to the graphs of Power Dissipation versus. Output Power dqtasheet the Typical Performance Characteristics. The choice of a heat sink for a high-power audio amplifier is. The thermal resistance from lm466t die junction to the outside. The LM has a sophisticated thermal protection scheme.
It starts operating again when the die temperature. This greatly reduces the stress imposed on the IC by.
Texas Instruments/TI LMT/NOPB – PDF Datasheet – Audio Power OpAmps In Stock |
Since the die temperature is directly dependent upon the. Using the best heat sink possible within the cost and. Power dissipation within the integrated circuit package is a.
Equation 1 exemplifies the theoretical maximum lm476t dis. Once the maximum package power dissipation has been. This calculation is made using Equation 3.
The LM has excellent power supply rejection and does. However, to improve system. LM should have its supply leads bypassed with. These instabilities can be eliminated through multiple. SPiKe Protection means that these parts are safeguarded at the output against overvoltage, un- dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks. Special Audio Amplifier Application Circuit 5 www. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 mA per mute pin or 2 mA total if both pins are tied together.
Upon turn-off, the output of the LM is brought to ground be- fore the power supplies such that no transients occur at power-down.
The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes. The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled. Please refer to AN for more detailed information. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated.
The package dissipation is twice the number which re- sults from Equation 1 since there are two amplifiers in each LM Refer to the graphs of Power Dissipation versus Output Power in the Typical Performance Characteristics section which show the actual full range of power dissipation not just the maximum theoretical point that results from Equation 1.
Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions.
Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section. An incorrect maximum power dissipation calculation may result in inad- equate heat sinking causing thermal shutdown and thus lim- iting the output power.
Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are lo- cated close to the package terminals.